TUCSEN

xiB Monochrome and Color models:

Model Sensor Resolution Pixel µm ADC bits FWC e- Sensor Diagonal Power Watt DR dB Frames per sec (1)
CB120MG-CM CMOSIS CMV12000 4096 x 3072, 12 MP 5.5 8,10,12 13500 28 mm 8 W 60 130, 103, 86
CB120CG-CM CMOSIS CMV12000 4096 x 3072, 12 MP 5.5 8,10,12 13500 28 mm 8 W 60 130, 103, 86
CB120RG-CM CMOSIS CMV12000 NIR (2) 4096 x 3072, 12 MP 5.5 8,10,12 13500 28 mm 8 W 60 130, 103, 86
CB120MG-CM-X8G3 CMOSIS CMV12000 4096 x 3072, 12 MP 5.5 8,10,12 13500 28 mm 17 W 60 330, 300, 130
CB120CG-CM-X8G3 CMOSIS CMV12000 4096 x 3072, 12 MP 5.5 8,10,12 13500 28 mm 17 W 60 330, 300, 130
CB200MG-CM CMOSIS CMV20000 5120 x 3840, 20 MP 6.4 12 15000 41 mm 6 W 66 33
CB200CG-CM CMOSIS CMV20000 5120 x 3840, 20 MP 6.4 12 15000 41 mm 6 W 66 33
CB500MG-CM CMOSIS CMV50000 7920 x 6004, 50 MP 4.6 12, 14 16000 35 mm 9 W 60 30, 26, 22
CB500CG-CM CMOSIS CMV50000 7920 x 6004, 50 MP 4.6 12, 14 16000 35 mm 9 W 60 30, 26, 22

(1) Full resolution at RAW 8 bits, 10 bits and 12 bits;  Server computers with bigger PCIe TLP packet size can increase the throughput by additional 10%.

(2) Near infrared (enhanced) version of the sensor. Not standard off-the-shelf product. Please contact XIMEA This e-mail address is being protected from spambots. You need JavaScript enabled to view it for price and MOQ discussion. 

Common features:

Sensor technology CMOS, Global shutter
Acquisition modes Continuous, software trigger, hardware trigger
Partial image readout ROI (region of interest), Multiple AOI (area of interest) and Skipping / Binning modes on request
Image data formats 8, 10, 12, 14 bit RAW pixel data (depends on the model) 
SDK/API programmable with C++ and C#
Color image processing* Host based de-Bayering, sharpening, Gamma, color matrix, true color CMS
Hot/blemish pixels correction* On camera storage of up to 5000 pixel coordinates, host assisted correction
Auto adjustments* Auto white balance, auto gain, auto exposure, HDR (High Dynamic range)

Flat field corrections*

Coming soon. Host assisted pixel level shading and lens corrections
FPN correction  Fixed pattern noise correction on the side of the camera
Interface PCI Express standard cable connector compliant to PCI Express External Cabling Specifications
General purpose I/O 2x opto-isolated input, 2x opto-isolated output, 4 non-isolated input-outputs, 4x LED software programmable 
Signal conditioning* Programmable debouncing time
Synchronization Hardware trigger input, software trigger, exposure strobe output, busy output
Lens mount Standard EF mount with Active Lens Control – focus, iris, image stabilization
Power requirements 6 Watt, supplied via power cable (depends on the version)
Dimensions 60 x 60 x 38 mm (depends on the version)
Weight 175 grams (depends on the version)
Environment Operating 0°C to 50°C on housing, RH 80% non-condensing, -30°C to 60°C storage
Conformity CE, FCC, RoHS, PCI Express External Cabling Specifications compliant
Operating systems Windows 7 SP1 (x86 and x64), Linux Ubuntu, Mac OS X (planned ARM)
Minimum host hardware

Intel i5 3.0GHz, +2GB RAM available physical memory, Motherboard with PCIe x4 Gen2 (or PCIe x8 Gen3) necessary for full throughput, compliance down to PCIe x1 Gen1 gives reduced throughput

Software support xiAPI SDK, adapters and drivers for 30 various image processing Libraries
Firmware updates Field firmware update through xiCOP. This feature is being developed and tested

(*) Feature is available only when the camera is in XIMEA API mode.